Flexible circuit boards are the only solution that meets the requirements of miniaturization and mobility for electronic products. It can bend, wrap, and fold freely, withstand millions of dynamic bends without damaging wires, can be arranged arbitrarily according to spatial layout requirements, and can move and stretch freely in three-dimensional space. Flexible circuit boards can greatly reduce the volume and weight of electronic products, suitable for the development of electronic products towards high density, miniaturization, and high reliability, thus achieving the integration of component assembly and wiring. FPC boards are currently undergoing rapid development despite their small scale. The polymer thick film method is an efficient and low-cost production process. This process selectively screens conductive polymer ink on inexpensive flexible substrates.

Jidong GC314 is a low viscosity CPP protective film with an average adhesion of about 1-5g and a material thickness of 4c. It belongs to the frosted transparent protective film, with a temperature resistance of up to 120 degrees and an acid alkali washing process. It is produced in a Class 1000 cleanroom with high cleanliness and is suitable for surface protection of ITO surface PET, PC, and flexible thin circuit boards.

GC314 TDS报告

厚度

Thickness

µm--40

粘着力 (对PMMA)

Adhesion for PMMA plate gf/25mm--1－6

JISZ0237(2000)(常溫)

抗拉强度

Tensile Strength MPa

MD30

ASTM D882

TD20

延伸率

Elongation %

MD700

ASTM D882

TD450

杨市系数

Young’s Modulus MPa

MD 500

ASTM D882

TD 530

信赖测试

耐高溫測試120±5℃/1hr 不残胶

耐低溫測試 -10±5℃/24hr 不残胶

光学特性

雾度42.4%

穿透率64%